Mechanical properties and microstructure of lead-free copper alloy using silicon

Abstract

Lead-free copper alloys are exposed in industrial processes to many stresses and change in their properties, so in the research, a study was conducted to evaluate the possibility of machining lead-free copper using silicon by weight (from 1% to 4%), which was prepared using copper alloys of 60% and Zn 40%. The formability of the alloy was tested based on cutting strength, tool wear, surface roughness, and wafer type in 1% silicon alloy, which shows maximum strength. Tool and surface roughness have lower values. Increasing the silicone content from 1% to 4%, reduced tool wear by 40%, and machine surface roughness by 25%, while the burr type changed from continuous type to intermittent type, and cutting strength was improved by 50%.